Join The Tech Innovation Excellence Award (“TIE Award”)

 The 2nd TIE Award is Now Open for Registration! We invite all startups worldwide to win the highest prize of 30,000 USD!

In 2023, the TIE Award will expand application eligibility under two themes, “Smart Innovation for Semiconductor” and “Technologies for Net-Zero Emissions.”

The winners will receive various award benefits, including cash prizes, partial subsidies for a business trip, and opportunities to partner with Taiwanese semiconductor companies and national-level research institutes.

Register for the TIE Awardhttps://bit.ly/405nBBQ

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